Karmarkar, Aditya P : rechercher sur Z-Library

Le plus grand référentiel d'articles scientifiques au monde. 70,000,000+ d'articles gratuitement.

Don't use scam websites

Livres
Articles (17)
Les plus populaires
Liste
- Liste
- Tableau

1

[IEEE 2009 IEEE International Reliability Physics Symposium - Montreal, QC, Canada (2009.04.26-2009.04.30)] 2009 IEEE International Reliability Physics Symposium - Performanace and reliability analysis of 3D-integration structures employing Through Silicon Via (TSV)

Karmarkar, Aditya P., Xu, Xiaopeng, Moroz, Victor

Année:

2009

Langue:

english

Fichier:

PDF, 620 KB

english, 2009

2

Performance and Reliability Impact of Copper Plasticity in Backside TSV-last Fabrication Process

Karmarkar, Aditya, Guo, Wei, Xu, Xiaopeng, Van der Plas, Geert, Van Huylenbroeck, Stefaan, Gonzalez, Mario, Absil, Philippe, El Sayed, Karim, Beyne, Eric

Journal:

IEEE Transactions on Device and Materials Reliability

Année:

2016

Langue:

english

Fichier:

PDF, 1.53 MB

english, 2016

3

Copper Anisotropy Effects in Three-Dimensional Integrated Circuits Using Through-Silicon Vias

Karmarkar, Aditya P., Xu, Xiaopeng, Yeap, Kong-Boon, Zschech, Ehrenfried

Journal:

IEEE Transactions on Device and Materials Reliability

Année:

2012

Langue:

english

Fichier:

PDF, 1020 KB

english, 2012

4

Corrections to “Copper Anisotropy Effects in Three-Dimensional Integrated Circuits Using Through-Silicon Vias” [Jun 12 225-232]

Karmarkar, Aditya P., Xu, Xiaopeng, Yeap, Kong-Boon, Zschech, Ehrenfried

Journal:

IEEE Transactions on Device and Materials Reliability

Année:

2012

Langue:

english

Fichier:

PDF, 52 KB

english, 2012

5

[IEEE 2010 IEEE Custom Integrated Circuits Conference -CICC 2010 - San Jose, CA, USA (2010.09.19-2010.09.22)] IEEE Custom Integrated Circuits Conference 2010 - Simulation methodology and flow integration for 3D IC stress management

Nakamoto, Mark, Radojcic, Riko, Wei Zhao,, Dasarapu, Vinay K., Karmarkar, Aditya P., Xu, Xiaopeng

Année:

2010

Langue:

english

Fichier:

PDF, 473 KB

english, 2010

6

[IEEE 2013 IEEE International Interconnect Technology Conference - IITC - Kyoto, Japan (2013.06.13-2013.06.15)] 2013 IEEE International Interconnect Technology Conference - IITC - Modeling of interconnect stress evolution during BEOL process and packaging

Shah, Chirag, Karmarkar, Aditya, Xu, Xiaopeng

Année:

2013

Langue:

english

Fichier:

PDF, 1.05 MB

english, 2013

7

[IEEE 2009 10th International Symposium on Quality of Electronic Design (ISQED) - San Jose, CA, USA (2009.03.16-2009.03.18)] 2009 10th International Symposium on Quality of Electronic Design - Analysis of performance and reliability trade-off in dummy pattern design for 32-nm technology

Karmarkar, Aditya P., Xu, Xiaopeng, Moroz, Victor, Rollins, Greg, Lin, Xiao

Année:

2009

Langue:

english

Fichier:

PDF, 1.11 MB

english, 2009

8

[IEEE 2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - San Hose, CA, USA (2014.5.20-2014.5.23)] IEEE International Interconnect Technology Conference - Reliability analysis of bumping schemes under chip package interaction

Kappaganthu, Sri Ramakanth, Karmarkar, Aditya, Xu, Xiaopeng, El Sayed, Karim, Avci, Ibrahim, Chawla, Vikas, Mishra, Bikash, Kucherov, Andrey, Zhou, Weixing, Johnson, Mark, Balasingam, Pratheep

Année:

2014

Langue:

english

Fichier:

PDF, 696 KB

english, 2014

9

Impact of Fabrication Process, Layout Variation and Packaging Process on Cu/Low-k Interconnect Reliability

Karmarkar, Aditya, Xu, Xiaopeng, Pramanik, Dipu, Lin, Xi-Wei, Rollins, Greg, Lin, Xiao

Journal:

MRS Proceedings

Année:

2007

Langue:

english

Fichier:

PDF, 175 KB

english, 2007

10

Numerical Analysis of Packaging-Induced Failures in Cu/Low-k Interconnects

Karmarkar, Aditya Pradeep, Xu, Xiaopeng, Lin, Xiao, Rollins, Greg, Moroz, Victor, Lin, Xi-Wei

Journal:

MRS Proceedings

Année:

2008

Langue:

english

Fichier:

PDF, 1.86 MB

english, 2008

11

Material, Process and Geometry Effects on Through-Silicon Via Reliability and Isolation

Karmarkar, Aditya P, Xu, Xiaopeng, Ramaswami, Sesh, Dukovic, John, Sapre, Kedar, Bhatnagar, Ajay

Journal:

MRS Proceedings

Année:

2010

Langue:

english

Fichier:

PDF, 481 KB

english, 2010

12

Microbump Impact on Reliability and Performance in Through-Silicon Via Stacks

Karmarkar, Aditya P., Xu, Xiaopeng

Journal:

MRS Proceedings

Année:

2011

Langue:

english

Fichier:

PDF, 328 KB

english, 2011

13

Silicon Interposer Reliability Optimization through Process-Oriented Stress Modeling

Kappaganthu, Sri Ramakanth, Karmarkar, Aditya, Xu, Xiaopeng

Journal:

MRS Proceedings

Année:

2012

Langue:

english

Fichier:

PDF, 686 KB

english, 2012

14

Viscoelastic Modeling and Reliability Assessment of Microelectronics Packages

Karmarkar, Aditya, Zhai, Charlie, Xu, Xiaopeng, Lin, Xiao, Rollins, Greg, Moroz, Victor

Journal:

MRS Proceedings

Année:

2009

Langue:

english

Fichier:

PDF, 414 KB

english, 2009

15

AIP Conference Proceedings [AIP Publishing LLC PROCEEDINGS OF THE 3RD INTERNATIONAL CONFERENCE ON MATHEMATICAL SCIENCES - Kuala Lumpur, Malaysia (17–19 December 2013)] - TCAD modeling of stress impact on performance and reliability in 3D IC structures

Xu, Xiaopeng, Karmarkar, Aditya

Année:

2014

Langue:

english

Fichier:

PDF, 2.31 MB

english, 2014

16

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Analysis of copper plasticity impact in TSV-middle and backside TSV-last fabrication processes

Guo, Wei, Karmarkar, Aditya P., Xu, Xiaopeng, Van der Plas, Geert, Van Huylenbroeck, Stefaan, Gonzalez, Mario, Absil, Philippe, El Sayed, Karim, Beyne, Eric

Année:

2015

Langue:

english

Fichier:

PDF, 1.21 MB

english, 2015

17

AIP Conference Proceedings [AIP STRESS MANAGEMENT FOR 3D ICS USING THROUGH SILICON VIAS: International Workshop on Stress Management for 3D ICs Using Through Silicon Vias - Albany, NY, USA - San Francisco, CA, USA - Dresden, Germany (March 16, 2010 - July 13, 2010 - October 20, 2010)] - 3D TCAD Modeling For Stress Management In Through Silicon Via (TSV) Stacks

Xu, Xiaopeng, Karmarkar, Aditya

Année:

2011

Langue:

english

Fichier:

PDF, 1.03 MB

english, 2011